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Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing

Journal Solid State Phenomena (Volumes 103 - 104)
Volume Ultra Clean Processing of Silicon Surfaces VII
Edited by Paul Mertens, Marc Meuris and Marc Heyns
Pages 241-244
DOI 10.4028/www.scientific.net/SSP.103-104.241
Citation Rita Vos et al., 2005, Solid State Phenomena, 103-104, 241
Online since April, 2005
Authors Rita Vos, E. Kesters, Sylvain Garaud, R. De Waele, Karine Kenis, Marcel Lux, H. Kraus, James Snow, Denis Shamiryan, Gabriela Catana, W. Deweerd, T. Schram, S. DeGendt, Paul W. Mertens
Keywords Backside Cleaning, High-k, Metal Gate, Single Wafer Cleaning
Abstract

In this work the removal of different metallic and particulate contaminants relevant for high-k/metal gate processing is studied. Best cleaning efficiency of both silicon and nitride substrates is achieved using a HF/HNO3-based cleaning resulting in a particle removal efficiency higher than 90% and metal removal down to 1010 at/cm2.

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