Paper Title:
Non-Contact Cleaning Process for Post-CMP Copper
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Periodical
Solid State Phenomena (Volumes 103-104)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
291-296
DOI
10.4028/www.scientific.net/SSP.103-104.291
Citation
D. A. Koos, J. Svirchevski, D. J. Vitkavage, D. G. Hansen, K. A. Reinhardt, F. Huang, M. Mitchel, G. Y. Zhang, "Non-Contact Cleaning Process for Post-CMP Copper", Solid State Phenomena, Vols. 103-104, pp. 291-296, 2005
Online since
April 2005
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