Paper Title:
Effects of Patterns on Corrosion in Cu CMP
  Abstract

Corrosion on specific Cu patterns was evaluated during Cu CMP. The corrosion was observed at isolated patterns and outer edge area of pad surrounded by oxide field after polishing and showed dependency on process. Two different commercial slurries were chosen and used for polishing after characterizing electrochemical and frictional properties. Stress simulations were conducted on these patterns. Higher stress was calculated on these patterns. The process temperature and friction behavior of Cu affected the magnitude of corrosion on Cu on these patterns.

  Info
Periodical
Solid State Phenomena (Volumes 103-104)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
369-372
DOI
10.4028/www.scientific.net/SSP.103-104.369
Citation
J. H. Han, J. E. Koo, D. H. Hong, B. L. Park, S. I. Kim, I.-S. Cho, D. H. Eom, J. G. Park, A. A. Busnaina, "Effects of Patterns on Corrosion in Cu CMP", Solid State Phenomena, Vols. 103-104, pp. 369-372, 2005
Online since
April 2005
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Price
$32.00
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