Effects of Patterns on Corrosion in Cu CMP |
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| Journal | Solid State Phenomena (Volumes 103 - 104) |
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| Volume | Ultra Clean Processing of Silicon Surfaces VII |
| Edited by | Paul Mertens, Marc Meuris and Marc Heyns |
| Pages | 369-372 |
| DOI | 10.4028/www.scientific.net/SSP.103-104.369 |
| Citation | Ja Hyung Han et al., 2005, Solid State Phenomena, 103-104, 369 |
| Online since | April, 2005 |
| Authors | Ja Hyung Han, Ja Eung Koo, Duk Ho Hong, Byung Lyul Park, Seong Il Kim, In-Soo Cho, Dae Hong Eom, Jin Goo Park, Ahmed A. Busnaina |
| Keywords | Corrosion, Cu CMP, Friction, Pattern Dependence |
| Abstract | Corrosion on specific Cu patterns was evaluated during Cu CMP. The corrosion was observed at isolated patterns and outer edge area of pad surrounded by oxide field after polishing and showed dependency on process. Two different commercial slurries were chosen and used for polishing after characterizing electrochemical and frictional properties. Stress simulations were conducted on these patterns. Higher stress was calculated on these patterns. The process temperature and friction behavior of Cu affected the magnitude of corrosion on Cu on these patterns. |
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