Paper Title:
Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication
  Abstract

This study deals with drying induced water marks dependency on the last cleaning methods, substrate conditions, and drying pre-step delaying times, which are supposed to become a big issue with down scaling of device geometry. The data show that water marks induced by drying failure increase with increasing contact angle on the various surfaces. They are mainly composed of either silicon oxide only or silicon oxide with organic compounds. The former is removed by a dilute HF and/or hot SC-1 treatment and the latter is removed by organic removal cleaning followed by dilute HF etching.

  Info
Periodical
Solid State Phenomena (Volumes 103-104)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
67-70
DOI
10.4028/www.scientific.net/SSP.103-104.67
Citation
G. H. Kim, G. M. Choi, Y. W. Song, "Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication", Solid State Phenomena, Vols. 103-104, pp. 67-70, 2005
Online since
April 2005
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Wim Fyen, Sophia Arnauts, Frank Holsteyns, G. Doumen, Guy Vereecke, Jan Van Steenbergen, Paul W. Mertens
Abstract:In this paper, a single wafer linear IPA vapour based vertical drying technique is presented. Using salt residue tests the performance of...
75
Authors: Seung Hun Lee, Eun A Lee, Hae Jin Hwang, Ji Woong Moon, In Sub Han, Sang Kuk Woo
Abstract:Hydrophobic silica aerogels were synthesized by an ambient pressure drying method from silicic acid with a different pH value, which was...
910
Authors: N. Kurumoto, Atsuro Eitoku, Katsuhiko Miya
Abstract:As the critical dimension of LSI continues to decrease, the surface tension of water and its effect on the formation of watermarks is...
91
Authors: Yan Hong Hu, Mei Li, Zhao Gang Liu, Mi Tang Wang, Jin Xiu Wu
Chapter 1: Materials Engineering
Abstract:The ultrafine CeO2 powder was prepared using NH4HCO3 as precipitation agent. The effects of six drying methods, such as room-temperature...
92
Authors: Zhi Guo Chang, Ji Xian Dong, Jiang Miao Yi
Chapter 2: Advanced Manufacturing Technology
Abstract:The drying section of paper machine is not only the major energy-consuming parts of the papermaking process, but also one of the main...
520