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Occurrence of Arsenic-Based Defects and Techniques for Their Elimination

Journal Solid State Phenomena (Volumes 103 - 104)
Volume Ultra Clean Processing of Silicon Surfaces VII
Edited by Paul Mertens, Marc Meuris and Marc Heyns
Pages 87-92
DOI 10.4028/www.scientific.net/SSP.103-104.87
Citation Felicia Goh et al., 2005, Solid State Phenomena, 103-104, 87
Online since April, 2005
Authors Felicia Goh, Christopher Lim, Vincent Sih, Zainab Ismail, Simon Y.M. Chooi
Keywords Arsenic Defects, HF, Pre-Silicidation Cleaning
Abstract

Arsenic based defects were found on the surfaces of advanced CMOS patterned wafers after the pre-silicidation HF clean. Investigations into the mechanism of formation were done using representative As-implanted bare silicon, polysilicon and HDP silicon oxide films. The nature and composition of these As-based defects are believed to be arsenic and arsenic oxide. Methods of defect removal include the application of hydrogen peroxide containing solutions and hydrogen plasma dry cleaning.

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