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Ultra Clean Processing of Silicon Surfaces VII

Solid State Phenomena Volumes 103 - 104

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• p269 Metal Contamination on Silicon Surfaces from Solvents   [ 20 M ]
  Authors: Twan Bearda, Ief Vander Mot, Kristel Van den Broeck, Nausikaä Van Hoornick, Jan Van Hoeymissen, Paul W. Mertens
• p275 Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP   [ 451 K ]
  Authors: Yi Koan Hong, Ja Hyung Han, Jin Hyung Lee, Jin Goo Park, Ahmed A. Busnaina
• p279 A Force Study in Brush Scrubbing   [ 16 M ]
  Authors: Kai Dong Xu, Rita Vos, Guy Vereecke, G. Doumen, Wim Fyen, Paul W. Mertens, Marc M. Heyns, Chris Vinckier, Jan Fransaer
• p283 Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning   [ 16 M ]
  Authors: S. Tamilmani, V. Lowalekar, Srini Raghavan, Robert Small
• p287 Investigation of Dissolution and Electrodeposition of Copper in Concentrated and Diluted Oxalic Acid Media in Post-CMP Cleaning   [ 262 K ]
  Authors: C. Gabrielli, C. Mace, J. Matha, S. Mège, E. Ostermann, H. Perrot
• p291 Non-Contact Cleaning Process for Post-CMP Copper   [ 161 K ]
  Authors: Daniel A. Koos, Julia Svirchevski, Daniel J. Vitkavage, David G. Hansen, Karen A. Reinhardt, Frank Huang, Marie Mitchel, Guang Ying Zhang
• p297 Novel Photo Resist Stripping for Single Wafer Process   [ 121 K ]
  Authors: Atsushi Okuyama, Kazumi Asada, Hitoshi Abe, Hayato Iwamoto, Yoshio Okamoto, Takuya Wada
• p301 Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives   [ 628 K ]
  Authors: Olivier Louveau, Emile Lajoinie, Olivier Pollet, Jean Philippe Odet, Sylviane Cêtre, Laurent Lachal, Béatrice Icard, Evelyne Tabouret, Marc Veillerot, Hervé Fontaine, Didier Louis
• p305 Cleaning Capability of High Concentration Ozonated Water   [ 1 M ]
  Authors: Teruo Haibara, Kenichi Uemura, Takio Adachi
• p309 Photoresist Stripping by Ozone/Water Processes: Effect of Additives   [ 72 K ]
  Authors: H. Vankerckhoven, F. De Smedt, K. Vandersmissen, M. Claes, Stefan De Gendt, Marc M. Heyns, Chris Vinckier
• p315 Supercritical CO₂ Applications in BEOL Cleaning   [ 645 K ]
  Authors: P.D. Matz, R.F. Reidy
• p323 Repair of Porous MSQ (p-MSQ) Films Using Monochlorosilanes Dissolved in Supercritical CO₂   [ 214 K ]
  Authors: Bo Xie, Anthony Muscat
• p327 Copper Decontamination Ability of Supercritical-CO₂/Additives on CVD and Spin-On Porous MSQ Materials   [ 16 M ]
  Authors: Jerome Daviot, V. Perrut, F. Gaillard, C. Millet, Adrien Danel, Lucile Broussous, Didier Louis
• p331 Angled XPS Analysis of Low-k Dielectric Surfaces after Cleaning   [ 20 M ]
  Authors: Y.S. Tan, Simon Y.M. Chooi, Chian-Yuh Sin, Ping-Yu Ee, M.P. Srinivasan, Simo Olavi Pehkonen
• p337 Impact of Downstream Ash Plasmas on Ultra Low-k Materials   [ 550 K ]
  Authors: Nicolas Possémé, Thibaut David, P. Meininger, O. Louveau, T. Chevolleau, O. Joubert, Didier Louis