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Ultra Clean Processing of Silicon Surfaces VII

Solid State Phenomena Volumes 103 - 104

• Papers
• Abstracts

• p345 Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect   [ 354 K ]
  Authors: Han Xu, Amy Shen, Vlad Tarasov, Brian White, Josh Wolf
• p349 Effect of Chemical Solution on the Stability of Low-k Films   [ 168 K ]
  Authors: E. Kesters, Quoc Toan Le, Mikhail R. Baklanov, Werner Boullart, Paul W. Mertens
• p353 Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow   [ 792 K ]
  Authors: Jian She Tang, Brian J. Brown, Steven Verhaverbeke, Han Wen Chen, Jim Papanu, Raymond Hung, Cathy Cai, Dennis Yost
• p357 Via Cleaning Technology for Post Etch Residues   [ 505 K ]
  Authors: B.G. Sharma, Chris Prindle
• p361 Barrier and Copper Seedlayer Wet Etching   [ 1 M ]
  Authors: Claire Therese Richard, M.M. Frank, Pascal Besson, E. Serret, N. Hotellier, Alessio Beverina, L. Dumas, Lucile Broussous, F. Kovacs, Thierry Billon
• p365 Deposition Behavior of Volatile Acidic Contaminants on Metallic Interconnect Surfaces   [ 189 K ]
  Authors: Hervé Fontaine, Marc Veillerot, Adrien Danel
• p369 Effects of Patterns on Corrosion in Cu CMP   [ 291 K ]
  Authors: Ja Hyung Han, Ja Eung Koo, Duk Ho Hong, Byung Lyul Park, Seong Il Kim, In-Soo Cho, Dae Hong Eom, Jin Goo Park, Ahmed A. Busnaina
• p373 Advanced Aqueous Cleaner II: PER Removal from Sensitive Cu/Low-k Devices   [ 561 K ]
  Authors: Chris Reid, Jerome Daviot, Douglas Holmes
• p377 Advanced Aqueous Cleaner I, Dilute Solutions for the Selective Removal of Post Etch Residues in the Presence of Aluminium   [ 343 K ]
  Authors: Jerome Daviot, Chris Reid, Douglas Holmes
• p381 New Post Etch Polymer Removal Process for Al-Interconnects and Vias in Tank and Spray Tools Using a New Inorganic Chemistry   [ 1 M ]
  Authors: Raimund Mellies, Stefan Kunz, Franz Nilius, Dieter Mayer, Andreas Kühner
• p385 Effective Polymer Removal: Process Window-Process Uniformity-Extended Chemical Bath-Life   [ 139 K ]
  Authors: Chuan Yew-Leong, Wee Boon-Lim, Wayne A-Cady, Nik A-Mustapha, Kah Keen-Lai