Oxygen Precipitation in Nitrogen Doped CZ Silicon

Nitrogen doping of CZ silicon results in an early formation of large precipitate nuclei during crystal cooling, which are stable at 900°C. These are prone to develop stacking faults and high densities of defects inside defect denuded zones of CZ silicon wafers. Simultaneous doping of FZ silicon with nitrogen and oxygen results in two main stages of precipitate nucleation during crystal cooling, an enhanced nucleation around 800°C, which is nitrogen induced, and a second enhancement around 600°C, which depends on the concentration of residual oxygen on interstitial sites. A combined technique of ramping with 1K/min from 500-1000°C with a final anneal at 1000°C for 2h and lateral BMD measurement by SIRM provides a possibility to delineate v/G on nitrogen-doped silicon wafers. Surface segregation of nitrogen and oxygen during out-diffusion can explain the enhanced BMD formation in about 105m depth and the suppressed BMD formation in about 405m depth below the surface. The precipitate growth is enhanced in regions where nitrogen is filled up again after a preceding out-diffusion.