The radiation defects in 10 Ω⋅cm p-type and 4.5 Ω⋅cm n-type Cz Si were created at depth of 0.8-1 µm using 100 keV 2⋅1016 at/cm2 hydrogen implantation at room temperature. Then the introduction of nitrogen into silicon and its diffusion were carried out at different thermodynamic conditions. Finally, the samples were vacuum annealed at 800 oС during 2 h. The state of sample surfaces was studied by SEM. The depth and thickness of SixNy layer and also defect numbers were estimated by RBS method in the channeling mode. The electrical properties of the obtained structures were characterized by the transversal conductance measurements with the keep of a standard LCR-meter at a frequency of 1 MHz using the two-probe method. Our experiments have shown that the above-described method enables one to form the buried SiхNy layer with dielectric properties and the number of defects and nitrogen atoms on the silicon surface and in the near-surface region are comparable with those for the initial silicon wafers.