Paper Title:
Image Wavelet Transform for PCB Soldering's Quality Evaluation
  Abstract

An integration degree of modern printed circuit boards (PCB) is continually increasing. One of the important stages in the manufacturing of electronic devices is component soldering onto PCB pads. The soldering process is affected by many factors, which may lead to the formation of undesirable soldering defects. Some kinds of defects including bridge defects are detected visually. In the current article the possibility of bridge defect detection in a multi-pin surface mount component PCB images using wavelet transform is analyzed.

  Info
Periodical
Solid State Phenomena (Volume 113)
Edited by
Nin Bizys, Andrejus Henrikas Marcinkevicius
Pages
85-90
DOI
10.4028/www.scientific.net/SSP.113.85
Citation
E. Zitkevicius, R. Martavicius, "Image Wavelet Transform for PCB Soldering's Quality Evaluation", Solid State Phenomena, Vol. 113, pp. 85-90, 2006
Online since
June 2006
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Price
$32.00
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