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Pulse Plasma Sintering of Nano-Crystalline Cu Powder

Journal Solid State Phenomena (Volume 114)
Volume High Pressure Technology of Nanomaterials
Edited by Witold Lojkowski and John R. Blizzard
Pages 239-244
DOI 10.4028/www.scientific.net/SSP.114.239
Citation Andrzej Michalski et al., 2006, Solid State Phenomena, 114, 239
Online since July, 2006
Authors Andrzej Michalski, Marcin Rosiński, D. Siemiaszko, Jakub Jaroszewicz, Krzysztof J. Kurzydłowski
Keywords Cu, Nanocrystalline, PPS, Sintering
Abstract

Nanocrystalline copper powders, produced by the reduction of the CuO with hydrogen, were consolidated using the pulse plasma sintering (PPS) method. The sintering process was carried out at temperatures between 500 and 900 oC under a load of 60 MPa for 5 min. The average crystallite size of the sintered component obtained at 500 oC was about 80nm and at 900 oC 1880 nm. The components produced at 500 oC had a relative density of 90 %, and those sintered at 900 oC 92 %; their hardness was 215 and 140 HV0.1, respectively.

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