Semi-solid forming (SSF) involves alloys with non-dendrite microstructure that contain spherical solid particles in the liquid matrix. This process is generally divided into three main steps: feedstock manufacturing, reheating and forming. Feedstock has the main effect on the cost and quality of product. Many researches have been carried out to reduce the cost of feedstock manufacturing. Slope plate is a simple semi-solid process that can reduce the cost of feedstock. In this study a Cu plate with water and without water circulation was used to investigate the effect of pouring temperature, cooling rate during casting and solidification in the mold on the microstructure. Cast ingots with optimized microstructure were reheated in various time and temperatures in semi-solid region to obtain kinetics of globularization and solid grain growth.