Effect of Characteristics of Nano-Colloidal Silica Abrasives on Wafer Surface Roughness for Wafer Touch Polishing |
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| Journal | Solid State Phenomena (Volumes 121 - 123) |
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| Volume | Nanoscience and Technology |
| Edited by | Chunli BAI, Sishen XIE, Xing ZHU |
| Pages | 1229-1232 |
| DOI | 10.4028/www.scientific.net/SSP.121-123.1229 |
| Citation | Jin Hyung Park et al., 2007, Solid State Phenomena, 121-123, 1229 |
| Online since | March, 2007 |
| Authors | Jin Hyung Park, Ung Yu Paik, Jea Gun Park |
| Keywords | Haze, Non-Ionic Surfactant, Roughness, Slurry, Wafer Polishing |
| Abstract | The purpose of this study is to reveal the mechanism of wafer touch polishing by high purity colloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). The effect of surfactant concentration on wafer touch polishing was studied with the aim of improving roughness on wafer surface after polishing. As a result, the level of haze and micro-roughness are decreased with the decrease of surfactant concentration. |
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