Improvement of Thermal Stability of Nickel Silicide Using Multi-Capping Structure |
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| Journal | Solid State Phenomena (Volumes 121 - 123) |
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| Volume | Nanoscience and Technology |
| Edited by | Chunli BAI, Sishen XIE, Xing ZHU |
| Pages | 1261-1264 |
| DOI | 10.4028/www.scientific.net/SSP.121-123.1261 |
| Citation | Yong Jin Kim et al., 2007, Solid State Phenomena, 121-123, 1261 |
| Online since | March, 2007 |
| Authors | Yong Jin Kim, Chel Jong Choi, Soon Young Oh, Jang Gn Yun, Won Jae Lee, Hee Hwan Ji, Jin Suk Wang, Hi Deok Lee |
| Keywords | Multi-Capping, Multi-Capping Layer, Salicide, Surface Morphology, Thermal Stability |
| Abstract | In this paper, the electrical properties of NiSi have been characterized using multi capping layer structure for nano CMOS application. We have investigated the formation and thermal stability of Ni silicide using Ni, Ti and TiN capping layers (Ti/Ni/TiN) as a function of Rapid Thermal Processing (RTP) temperature. It was shown that the NiSi with multi capping layer has lower sheet resistances than that with single capping (TiN) layer. NiSi with multi capping layer also showed much better thermal stability. It was verified that the formation Ni-Ti-Si ternary like layer at the top region of thhe NiSi results in improvement of thermal stability. |
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