Paper Title:
The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp
  Abstract

We investigated the non-uniformity of the residual layer thickness caused by wafer deformation in an experiment that examined different wafer thicknesses using UV-NIL with an element-wise patterned stamp (EPS). Experiments using the EPS were performed on an EVG®620-NIL. Severe deformation of the wafer served as an obstacle to the spread of resin drops, which caused non-uniformity of the residual layer thickness. We also simulated the imprint process using a simplified model and finite element method to analyze the non-uniformity.

  Info
Periodical
Solid State Phenomena (Volumes 121-123)
Edited by
Chunli BAI, Sishen XIE, Xing ZHU
Pages
649-652
DOI
10.4028/www.scientific.net/SSP.121-123.649
Citation
K. D. Kim, Y. S. Sim, J. H. Jeong, H. K. Sohn, E. S. Lee, S. C. Lee, L. M. Fang, "The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp", Solid State Phenomena, Vols. 121-123, pp. 649-652, 2007
Online since
March 2007
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$32.00
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