The effect of a microwave-enhanced wet chemical etching process of SiC particles on the electroless copper plating and on the Al/Cu-coated SiC composites was investigated. The microwave-enhanced wet etching process increased the concentration of surface oxides on SiC. The BET surface area of SiC increased, reached its maximum value at 30 s, and then decreased during an etching process. The enhanced chemical adhesion strength between the coated copper and SiC was observed after an etching process. Furthermore, the sintering density and transverse rupture strength (TRS) of Al/Cu-coated SiC composites were improved when SiC particles were etched. This result indicated that the microwave-enhanced etching of SiC particles also improved chemical and mechanical adhesion of Al/Cu-coated SiC composites.