Paper Title:
Piezoelectric Bimorph Microphone with Low Stress Parylene Diaphragm
  Abstract

This paper describes a micromachined piezoelectric bimorph microphone, which is built on a low stress Parylene diaphragm with high quality ZnO films. The ZnO thin film has fine grain with the average grain size less than 1  and the grain orientation is perpendicular to the substrate. The highest sensitivity of piezoelectric bimorph microphone fabricated in this study is about 0.74 mV/Pa, which is twice higher than that of an individual segmented electrode. Based upon the experimental results, we proposed the equivalent electrical circuit model of piezoelectric bimorph microphone.

  Info
Periodical
Solid State Phenomena (Volumes 124-126)
Edited by
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
Pages
161-164
DOI
10.4028/www.scientific.net/SSP.124-126.161
Citation
S. H. Yi, M. S. Yoon, S. C. Ur, "Piezoelectric Bimorph Microphone with Low Stress Parylene Diaphragm", Solid State Phenomena, Vols. 124-126, pp. 161-164, 2007
Online since
June 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Soe Shwe Nay, Shang Chun Fan, Zhan She Guo
Abstract:This paper presents about the optimization design of Silicon resonant pressure sensor. The new idea is the Silicon circular resonator was...
2256
Authors: Sheng Jin, Srihari Rajgopal, Mehran Mehregany
Chapter 6: SiC Devices, Circuits and Systems
Abstract:We report two improvements of our all-silicon carbide (SiC) micromachined capacitive diaphragm-based pressure sensors: Ti/TaSi2/Pt contact...
1211
Authors: Zi Jun Song, Xiang Wang, Yan Li, Hai Sheng San, Yu Xi Yu
Chapter 1: CAD/CAM
Abstract:An improved piezoresistive pressure sensor is designed for harsh environment application. The highlight of this design is that the Wheatstone...
318
Authors: Hao Jie Lv, Hui Yong Yu, Jiang Hua Hou, Tao Geng
Chapter 6: Sensors and Its Application
Abstract:In the paper, a Double-notches Touch Mode Capacitive Pressure Sensor (DTMCPS) is presented. The sensor employs a special SiC-AlN-SiC sandwich...
984
Authors: Wen Xiao Fang, Qin Wen Huang
Chapter 3: Product and Devices Design, Modelling, Simulation, Analisys and Manufacture
Abstract:This paper describes our recent work on the mechanical reliability of a commercial MEMS microphone by performing three mechanical tests, i.e....
551