Paper Title:
Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni
  Abstract

A preplated frame (PPF) consisting of Au/Pd/Cu-Sn/Cu substrate, i.e., preplated with a Cu-Sn alloy instead of Ni commercially used, was fabricated by electroplating and then the feasibility of the frame as an alternative PPF was investigated. The wettability of the Cu-Sn alloy was better than that of Ni, resulting in excellent contact with the substrate and smoother surface on the upper Au/Pd protective layer. By XPS analyses, it was confirmed that Cu atoms in the Cu-Sn alloy layer did not diffuse through the thin protective layer to the surface at temperatures used in IC assembly. The wire pull-strength and solderability of the Cu-Sn alloy PPF were almost equivalent to those of the Ni PPF. However, the former showed much better corrosion resistance than the latter.

  Info
Periodical
Solid State Phenomena (Volumes 124-126)
Edited by
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
Pages
227-230
DOI
10.4028/www.scientific.net/SSP.124-126.227
Citation
D. H. Lee, T. S. Jang, J.H. Jung, S.S. Hong, E.S. Park, J.W. Lee, B.K. Hahn, "Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni", Solid State Phenomena, Vols. 124-126, pp. 227-230, 2007
Online since
June 2007
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$32.00
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