Bump Formation and Flip Chip Processes for RF System-on-Packages |
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| Journal | Solid State Phenomena (Volumes 124 - 126) |
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| Volume | Advances in Nanomaterials and Processing |
| Edited by | Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park |
| Pages | 25-28 |
| DOI | 10.4028/www.scientific.net/SSP.124-126.25 |
| Citation | Boo Yang Jung et al., 2007, Solid State Phenomena, 124-126, 25 |
| Online since | June, 2007 |
| Authors | Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh |
| Keywords | Bump, Electronic Package, Flip Chip, RF Package, SOP |
| Abstract | For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solder joints was about 13m/ which was much lower than 24~33m/ of the non-reflowed Sn/In/Sn bump joints. The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding. |
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