Paper Title:
Bump Formation and Flip Chip Processes for RF System-on-Packages
  Abstract

For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solder joints was about 13m/ which was much lower than 24~33m/ of the non-reflowed Sn/In/Sn bump joints. The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding.

  Info
Periodical
Solid State Phenomena (Volumes 124-126)
Edited by
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
Pages
25-28
DOI
10.4028/www.scientific.net/SSP.124-126.25
Citation
B. Y. Jung, E. K. Choi, Y. S. Jeon, K. Y. Lee, K. S. Seo, T. S. Oh, "Bump Formation and Flip Chip Processes for RF System-on-Packages", Solid State Phenomena, Vols. 124-126, pp. 25-28, 2007
Online since
June 2007
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Price
$32.00
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