Bump Formation and Flip Chip Processes for RF System-on-Packages |
| Journal |
Solid State Phenomena (Volumes 124 - 126) |
| Volume |
Advances in Nanomaterials and Processing |
| Edited by |
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park |
| Pages |
25-28 |
| DOI |
10.4028/www.scientific.net/SSP.124-126.25 |
| Online since |
June, 2007 |
| Authors |
Boo Yang Jung,
Eun Kyoung Choi,
Young Soo Jeon,
Kwang Yong Lee,
Kwang Seok Seo,
Tae Sung Oh
|
| Keywords |
Bump, Electronic Package, Flip Chip, RF Package, SOP |
| Abstract |
For flip-chip process of RF system-on-packages(SOP), double bump bonding processes
were investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process,
and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The
height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the
non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solder
joints was about 13m/ which was much lower than 24~33m/ of the non-reflowed Sn/In/Sn bump joints.
The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the
non-reflowed double bump bonding. |
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