Paper Title:
Microstructural Study on the Wear Behavior of Cu-TiB2 Composites for Electrical Contact Materials
  Abstract

We have studied on the wear behavior of Cu-TiB2 composites, produced by thermal extraction, as a function of dispersed particle sizes and volume fractions of TiB2. The depth of subsurface zone was increased with applied loads from 25 μm with 20 N to 25 μm with 80 N. From the analyses results of the formation of wear debris generated by cracks between work hardened layer and matrix, wear mechanism is changed from abrasive wear to adhesive wear with increasing loads from 20 N to 80 N. The formation of sub-grains in the region of subsurface was clearly observed from the sample tested over 60 N loads. We attribute the formation of sub-grains to the plastic lubricant effect of TiB2 which gives arising from the contact stress and local heat generated during wear test.

  Info
Periodical
Solid State Phenomena (Volumes 124-126)
Edited by
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
Pages
255-258
DOI
10.4028/www.scientific.net/SSP.124-126.255
Citation
T. W. Lee, C. S. Shin, K. M. Kang, "Microstructural Study on the Wear Behavior of Cu-TiB2 Composites for Electrical Contact Materials", Solid State Phenomena, Vols. 124-126, pp. 255-258, 2007
Online since
June 2007
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Price
$32.00
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