Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test |
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| Journal | Solid State Phenomena (Volumes 124 - 126) |
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| Volume | Advances in Nanomaterials and Processing |
| Edited by | Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park |
| Pages | 5-8 |
| DOI | 10.4028/www.scientific.net/SSP.124-126.5 |
| Citation | Ja Myeong Koo et al., 2007, Solid State Phenomena, 124-126, 5 |
| Online since | June, 2007 |
| Authors | Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung |
| Keywords | Ball Shear Test, Flip Chip, High Temperature Storage Test (HTS Test), Interfacial Reaction, Isothermal Ageing, Sn-37Pb (Eutectic Tin-Lead), Solder Bump, Under Bump Metallization (UBM) |
| Abstract | The interfacial reactions and shear properties of Sn-37Pb (wt.%) solder bumps with two different under bump metallizations (UBMs), Cu and Ni, were investigated after high temperature storage (HTS) tests at 150 C for up to 65 days. Two different intermetallic compounds (IMCs), Cu6Sn5 and Cu3Sn, were formed at the bump/Cu interface, whereas only a Ni3Sn4 IMC layer was formed at the bump/Ni interface. The thicknesses of these IMCs increased linearly with the square root of duration time. The IMC growth rate at the bump/Cu UBM interface was much greater than that at the bump/Ni UBM interface. The shear properties of the bumps with the Cu UBM were greatly decreased with increasing duration time, compared with those with the Ni UBM. |
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