Paper Title:
Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics
  Abstract

The growing importance of high integration on electronics demands novel interconnection methods replacing high-cost solder bumping or less reliable conductive adhesives. Self-organizing interconnection process using resin containing solder fillers has a possibility to achieve high-density joints satisfying both needs. Numerical study visualized the process and revealed that surface tension of molten fillers and resin viscosity determine the speed of conductive path formation.

  Info
Periodical
Solid State Phenomena (Volumes 124-126)
Edited by
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
Pages
543-546
DOI
10.4028/www.scientific.net/SSP.124-126.543
Citation
K. Ohta, K. Yasuda, M. Matsushima, K. Fujimoto, "Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics", Solid State Phenomena, Vols. 124-126, pp. 543-546, 2007
Online since
June 2007
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Price
$32.00
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