Paper Title:
Fabrication of Pb-Free Silver Paste and Thick Film Adding Silver Nanoparticles
  Abstract

Fabrication of paste at low temperature has been developed in order to apply for various electronic devices, such as bus electrode and address electrode in PDP, especially for enlargement of a screen size. In this study, nano-sized silver particles with 10 - 30 nm were synthesized from silver nitrate (AgNO3) by a chemical reduction method. To prepare Pb-free silver paste, the silver nanoparticles were mixed with conventional silver powder with an average particle size of 1.6  and conventional Pb-free frit. Thick films were fabricated from silver paste by a screen printing on alumina substrate and the films were fried at temperatures ranging from 550 °C to 600 °C. Microstructures of the fried thick films were analyzed by FE-SEM. Sheet resistivity of fried thick films was measured and also the relationship between sinterability and conductivity of these films were investigated.

  Info
Periodical
Solid State Phenomena (Volumes 124-126)
Edited by
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
Pages
639-642
DOI
10.4028/www.scientific.net/SSP.124-126.639
Citation
S. H. Park, D. S. Seo, J. K. Lee, "Fabrication of Pb-Free Silver Paste and Thick Film Adding Silver Nanoparticles", Solid State Phenomena, Vols. 124-126, pp. 639-642, 2007
Online since
June 2007
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Price
$32.00
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