Paper Title:
Characteristics of Thermal Performance in High Power LED Package with Heat Pipe
  Abstract

This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

  Info
Periodical
Solid State Phenomena (Volumes 124-126)
Edited by
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
Pages
85-88
DOI
10.4028/www.scientific.net/SSP.124-126.85
Citation
W. J. Hwang, H. J. Yeo, M. W. Shin, "Characteristics of Thermal Performance in High Power LED Package with Heat Pipe", Solid State Phenomena, Vols. 124-126, pp. 85-88, 2007
Online since
June 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Sung Jun Lee, Ji Hyun Park, Chang Hyun Lim, Won Kyu Jeong, Seog Moon Choi, Yong Soo Oh
Abstract:By the development of high power LED for solid states lighting, the requirement for driving current has increased critically, thereby...
309
Authors: Yun Yang, Yong Feng Zhang
Chapter 16: Friction, Wear and Lubrication
Abstract:The purpose of this study is to investigate the fire possibility of the cotton packages by the friction heating during the transportation by...
787
Authors: P. Veeramuthuvel, S. Jayaraman, Krishnapillai Shankar, M. Annadurai, A.K. Sharma
Chapter 7: Vibration and Control
Abstract:The electronics package in a spacecraft is subjected to a variety of dynamic loads during launch phase and suitable thermal environment for...
2117