Paper Title:
Bonding Strength of W-Cu Joint by PECS Method
  Abstract

To make the tungsten and copper joint, several methods has been tried using the diffusion bonding system. When the thin plating Ni layer was used as the interlayer on tungsten surface, it bonded with copper under low bonding temperature and short holding duration by the pulse electric current sintering (PECS) machine. The effects of bonding temperature, bonding duration time, bonding pressure and the difference of specimen shape on the bonding strength were investigated. The tensile strength of joints depended on these factors. Highest strength attained to the copper tensile strength.

  Info
Periodical
Solid State Phenomena (Volume 127)
Edited by
Masaaki Naka
Pages
271-276
DOI
10.4028/www.scientific.net/SSP.127.271
Citation
Y. Fukuzawa, S. Nagasawa, S. Takaoka, "Bonding Strength of W-Cu Joint by PECS Method ", Solid State Phenomena, Vol. 127, pp. 271-276, 2007
Online since
September 2007
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