Paper Title:
Refinement of the Cu Structure by Oscillatory Compression Test
  Abstract

Polycrystalline Cu has been deformed at room temperature by oscillatory compression method to true reduction εh = 0.6 and 1. Microstructure by using transmission electron microscopy (TEM) and texture evolution after deformations was investigated. Oscillatory compressed microareas contains two distinctive regions: fine grains inside banded microstructure with large misorientation and surrounding matrix with submicrometer subgrains with a fraction of both low and high angle boundaries. Moreover nucleation of new grains under recrystallization takes place at the local-regions. The study of the crystal orientation distribution during applied deformation showed that the pole figure registered for the sample after compression shows ring of pole density, which concentrates around projection of <011>. Oscillatory compression causes formation of two axial texture components: <001> and <011>.

  Info
Periodical
Solid State Phenomena (Volume 130)
Edited by
Danuta Stróż & Małgorzata Karolus
Pages
111-116
DOI
10.4028/www.scientific.net/SSP.130.111
Citation
K. Rodak, T. Goryczka, "Refinement of the Cu Structure by Oscillatory Compression Test", Solid State Phenomena, Vol. 130, pp. 111-116, 2007
Online since
December 2007
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$32.00
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