Paper Title:
Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal
  Abstract

T type megasonic waveguide was analyzed by finite element method (FEM), acoustic pressure measurements and particle removal efficiency for the single wafer cleaning application. Compared to conventional longitudinal waves, a transverse waves were generated in a T type waveguide. Not like longitudinal waves, transverse waves showed changes of direction and phase which increased the cleaning efficiency.

  Info
Periodical
Solid State Phenomena (Volume 134)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
229-232
DOI
10.4028/www.scientific.net/SSP.134.229
Citation
Y. L. Lee, E. S. Lim, K. J. Kang, H. S. Kim, T. G. Kim, S. H. Lee, J. G. Park, "Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal", Solid State Phenomena, Vol. 134, pp. 229-232, 2008
Online since
November 2007
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