Paper Title:
Mapping of Metallic Contamination Using TXRF
  Abstract

  Info
Periodical
Solid State Phenomena (Volume 134)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
269-272
DOI
10.4028/www.scientific.net/SSP.134.269
Citation
A. Danel, Y. Borde, M. Veillerot, N. Cabuil, H. Kono, M. Yamagami, "Mapping of Metallic Contamination Using TXRF", Solid State Phenomena, Vol. 134, pp. 269-272, 2008
Online since
November 2007
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hidekazu Hayashi, Ken Tsugane, Yasushi Kagoshima, Takahisa Koyama, Masaharu Watanabe, Yasushi Kozuki
Abstract:Cu contamination control is critically important in Cu interconnect device manufacturing lines. The frontside gas protected spin cleaning...
217
Authors: Chris Sparks, Joel Barnett, Diane K. Michelson, Carolyn Gondran, Seung Chul Song, Angela Martinez, Hikari Takahara, Hiroyuki Murakami, Toru Kinashi
285
Authors: Hikari Takahara, Ken Tsugane
Abstract:In the semiconductor industry, the edge exclusion of processed wafers is decreasing to accommodate more integrated circuits. With this...
105
Authors: Adrien Danel, S. Sage, M.C. Roure, D. Peters, Jeff Hawthorne, R. Spicer
Abstract:The monitoring and optimization of wet clean and surface preparation processes is a major challenge in the microelectronics industry [1, 2]....
109
Authors: Yannick Borde, Adrien Danel, A. Roche, Hervé Fontaine, C. Brych
Abstract: After technical results presented the last two years and new results on volatile contamination, this paper reviews the contamination...
159