Paper Title:
Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution
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Periodical
Solid State Phenomena (Volume 134)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
333-336
DOI
10.4028/www.scientific.net/SSP.134.333
Citation
D. Rébiscoul, N. Lopez, L. Broussous, D. Louis, G. Passemard, "Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution", Solid State Phenomena, Vol. 134, pp. 333-336, 2008
Online since
November 2007
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