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Ultra Clean Processing of Semiconductor Surfaces VIII

Solid State Phenomena Volume 134

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• p129 I: Ultra-Shallow Junction Cleaning: Metrology for Evaluating Dopant Loss and Substrate Erosion   [ 152 K ]
  Authors: Mike S. Ameen, Aseem K. Srivastava, Ivan L. Berry
• p133 II: Ultra-Shallow Junction Cleaning: Methodologies for Process and Chemistry Optimization   [ 143 K ]
  Authors: Aseem K. Srivastava, Ke Ping Han, Mike S. Ameen, Ivan L. Berry, Stu Rounds
• p139 Effect of Dopants on the Dissolution Behavior of Silicon Substrates in HF-Based Cleaning Solutions   [ 164 K ]
  Authors: Salima Abu Jeriban, Ivette Guiot, Luc Bacherius, Joris Proost, Erik Sleeckx, Rita Vos, Paul W. Mertens
• p143 The Effect of Various Process Induced Damages on Wet Etching Rate Difference   [ 664 K ]
  Authors: Hyo Geun Yoon, Sang Hyun Lee, Woo Jin Kim, Geun Min Choi, Young Wook Song
• p151 How Bubbles (Can) Clean   [ 498 K ]
  Authors: Claus Dieter Ohl, Rory Dijkink, Manish Arora, Detlef Lohse
• p155 Aging Phenomena in the Removal of Nano-Particles from Si Wafers   [ 127 K ]
  Authors: Guy Vereecke, J. Veltens, Kai Dong Xu, Atsuro Eitoku, Kenichi Sano, Sophia Arnauts, Karine Kenis, James Snow, Chris Vinckier, Paul W. Mertens
• p159 Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP   [ 2 M ]
  Authors: Yi Koan Hong, Young Jae Kang, Jin Goo Park, Sang Yeob Han, Seong Kyu Yun, Bo Un Yoon, Chang Ki Hong
• p165 Particle-Substrate Interaction Forces in a Non-Polar Liquid   [ 368 K ]
  Authors: Francesca Barbagini, Wim Fyen, Jan Van Hoeymissen, Paul W. Mertens, Jan Fransaer
• p169 Interaction Forces between Oxide and Silica-Modified Terpolymer Abrasive and their Impact on CMP and Post-CMP   [ 148 K ]
  Authors: Silvia Armini, Ruslan Burtovyy, Igor Luzinov, Caroline M. Whelan, Karen Maex, Mansour Moinpour
• p173 Particle Deposition and Removal from Ge Wafers   [ 149 K ]
  Authors: Sonja Sioncke, Marcel Lux, Wim Fyen, Marc Meuris, Paul W. Mertens, Antoon Theuwis
• p177 A Study of a Single-Wafer Process in Metal Contact Hole Cleaning   [ 1 M ]
  Authors: Jae Yong Park, Jong Kook Song, Han Mil Kim, Hee Kang Cho, Tae Gyun Kim, Bong Ho Moon, Eun Su Rho, Leo Archer, Won Ho Cho
• p181 The Active Role of Etch Products in Particle Removal by SC-1 Solutions   [ 287 K ]
  Authors: Alexander Pfeuffer, Wolfgang Bensch, Alfred Lechner, Harald Okorn-Schmidt
• p185 New FEOL Cleaning Technology for Advanced Devices beyond 45 nm Node   [ 184 K ]
  Authors: Hiroshi Tomita, Yuji Yamada, Hidenobu Nagashima, Norio Ishikawa, Yumiko Taniguchi
• p189 In Situ Particle Removal Studies Using an Optical Particle Counter   [ 179 K ]
  Authors: D. Martin Knotter, Roy Te Brake, Michiel Enkelaar
• p193 Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic   [ 181 K ]
  Authors: Guy Vereecke, T. Veltens, Atsuro Eitoku, Kenichi Sano, G. Doumen, Wim Fyen, Kurt Wostyn, James Snow, Paul W. Mertens