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Ultra Clean Processing of Semiconductor Surfaces VIII

Solid State Phenomena Volume 134

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• p325 Photoresist Characterization and Wet Strip after Low-k Dry Etch   [ 493 K ]
  Authors: Martine Claes, Quoc Toan Le, J. Keldermans, E. Kesters, Marcel Lux, A. Franquet, Guy Vereecke, Paul W. Mertens, M.M. Frank, Robert Carleer, P. Adriaensens, D. Vanderzande
• p329 Implications of the Selectiveness of Cu Chelators on Cu⁰, Cu(I)O and Cu(II)O Powders   [ 300 K ]
  Authors: Jennie Macdougall, Chris Reid, Larry McGhee
• p333 Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution   [ 148 K ]
  Authors: Diane Rébiscoul, N. Lopez, Lucile Broussous, Didier Louis, G. Passemard
• p337 Marangoni Dryer Integrated High Performance Cleaner for Cu/Low k Post Strip Clean for 45nm Technology Node and Beyond   [ 427 K ]
  Authors: Jian She Tang, Wei Lu, Bo Xi, Eli Martinez, Fred Li, Alex Ko, Craig Todd, John T.C. Lee
• p341 Effect of Pressure Pulsation on Post-Etch Photoresist Stripping on Low-k Films in Supercritical CO₂   [ 847 K ]
  Authors: H. Kiyose, K. Saito, I. Mizobata, T. Iwata, S. Hirae, Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori
• p345 Optimization of a SC CO₂ Post-Etch Cleaning for Copper Interconnections   [ 2 M ]
  Authors: Diane Rébiscoul, V. Perrut, C. Ventosa, M. Assous, Didier Louis, G. Passemard
• p351 Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect   [ 1 M ]
  Authors: Han Xu, Thibaut David, Yin Xu, Vlad Tarasov, Nicolas Possémé, Didier Louis
• p355 Effect of Wafer Rotation on Photoresist Stripping in Supercritical CO₂   [ 303 K ]
  Authors: Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori, K. Saito, I. Mizobata, T. Iwata, S. Hirae
• p359 Metal Hard Mask Employed Cu/Low k Film Post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow   [ 2 M ]
  Authors: Miao Chun Lin, Mei Qi Wang, Joe Lai, Ren Huang, Cheng Ming Weng, J.H. Liao, Jian She Tang, Ching Hwa Weng, Wei Lu, Han Wen Chen, John T.C. Lee
• p363 Mechanism and Principles of Post Etch Al Cleaning with Inorganic Acids   [ 933 K ]
  Authors: Steven Verhaverbeke, Roman Gouk, Jim Papanu, Han Wen Chen
• p367 AlCu Metal Line Corrosion: A Case Study   [ 1 M ]
  Authors: Francesco Pipia, Annamaria Votta, Gloria Obetti, Enrico Bellandi, Mauro Alessandri, Thomas Nolan
• p371 Copper Surface Analysis with ToF-SIMS: Spectra Interpretation and Stability Issues   [ 163 K ]
  Authors: Chantal Trouiller, Sébastien Petitdidier, X. Ravanel, Lucile Broussous, M. Juhel, L.F.Tz. Kwakman, C. Wyon
• p375 Influence of the Process Conditions of a Polishing Rinse after CuCMP   [ 159 K ]
  Authors: Andrea Filippini, Sébastien Petitdidier, Chantal Trouiller, Alexandre Couvrat, Marie Christine Luche, Eric Sabouret
• p379 Wet Process Developments for Electrical Properties Improvement Of 3D MIM Capacitors   [ 177 K ]
  Authors: Claire Therese Richard, D. Benoit, S. Cremer, L. Dubost, B. Iteprat, M. Vincent, E. De Bock, C. Perrot, C. Rossato, M. Proust, S. Guillaumet