Paper Title:
The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining
  Abstract

In this study, joining characteristics of dissimilar Ti and Cu metals have been investigated, when using both an Ag-based eutectic alloy as a filler and an Ag layer present on Ti base metal as a diffusion barrier. The observed microstructures were classified into three characteristic types, depending on the presence of a Ag layer at the Ti interface, e.g. first, the sample retaining thick continuous intermetallic layers, e.g. Ti2Cu, TiCu, Ti3Cu4, Ti2Cu3, and TiCu4 by a significant dissolution of the Ti atoms into the molten filler, in the absence of a Ag coating layer onto the Ti base metal, second, the sample with relatively thin Ti-Cu intermetallic layers by the reduced reaction of Ti with Cu due to a prominent decrease in the Ti dissolution, owing to the role of the Ag coating layer as a diffusion barrier, and finally, the sample without any brittle Ti-Cu intermetallics in the joint by a complete suppression of both the dissolution of the Ti atoms and its reaction with the Cu elements in the molten filler due to the presence of a Ag layer.

  Info
Periodical
Solid State Phenomena (Volume 135)
Edited by
Chang Kyu Rhee
Pages
135-138
DOI
10.4028/www.scientific.net/SSP.135.135
Citation
M. K. Lee, J. G. Lee, J. K. Lee, J. J. Park, Y. R. Uhm, C. K. Rhee, "The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining", Solid State Phenomena, Vol. 135, pp. 135-138, 2008
Online since
February 2008
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