Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders |
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| Journal | Solid State Phenomena (Volume 138) |
|---|---|
| Volume | Solid Phase Transformations |
| Edited by | J. Čermák and I. Stloukal |
| Pages | 153-158 |
| DOI | 10.4028/www.scientific.net/SSP.138.153 |
| Citation | V.I. Dybkov, 2008, Solid State Phenomena, 138, 153 |
| Online since | March, 2008 |
| Authors | V.I. Dybkov |
| Keywords | Growth Kinetic, Liquid Sn-Base Solders, Ni3Sn4 Intermetallic Layer |
| Abstract | The Ni3Sn4 intermetallic layer occurs at the interface of nickel and the saturated or undersaturated Sn-base solder melt at 250-450 °C and dipping times of 300 to 2400 s. Mathematical equations are proposed to evaluate the thickness of the Ni3Sn4 layer formed under conditions of simultaneous dissolution in the undersaturated solder melt. |
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