Paper Title:
Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders
  Abstract

The Ni3Sn4 intermetallic layer occurs at the interface of nickel and the saturated or undersaturated Sn-base solder melt at 250-450 °C and dipping times of 300 to 2400 s. Mathematical equations are proposed to evaluate the thickness of the Ni3Sn4 layer formed under conditions of simultaneous dissolution in the undersaturated solder melt.

  Info
Periodical
Solid State Phenomena (Volume 138)
Edited by
J. Čermák and I. Stloukal
Pages
153-158
DOI
10.4028/www.scientific.net/SSP.138.153
Citation
V. I. Dybkov, "Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders ", Solid State Phenomena, Vol. 138, pp. 153-158, 2008
Online since
March 2008
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