Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints |
| Journal |
Solid State Phenomena (Volume 139) |
| Volume |
Theory, Modeling and Numerical Simulation |
| Pages |
151-156 |
| DOI |
10.4028/www.scientific.net/SSP.139.151 |
| Online since |
April, 2008 |
| Authors |
Tarik Omer Ogurtani,
Oncu Akyildiz
|
| Keywords |
Computer Simulation, Electromigration, Models of Non-Equilibrium Phenomena, Stress Gradient, Temperature Gradient |
| Abstract |
The morphological evolution of intragranular voids induced by the surface drift-diffusion
under the action of capillary forces, electromigration (EM) forces, and thermal stress gradients
(TSG) associated with steady state heat flow is investigated in passivated metallic thin films via
computer simulation using the front-tracking method. As far as the device reliability is concerned,
the most critical configuration for interconnect failure occurs even when thermal stresses are low if
the normalized ratio of interconnect width to void radius is less than certain range of values (which
indicates the onset of heat flux crowding). This regime manifests itself by the formation of two
symmetrically disposed finger shape extrusions (pitchfork shape slits) on the upper and lower
shoulders of the void surface on the windward side. The void growth (associated with
supersaturated vacancy condensation) on the other hand inhibits anode displacement but enhances
cathode and shoulder slit velocities drastically, which causes lateral spreading. |
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