Paper Title
Authors: Hiroshi Tomita, Minako Inukai, Kaori Umezawa, Li Nan Ji
Abstract:It is well known that the physical force cleaning such as megasonic (MS) and ultrasonic (US) cleaning are used in FEOL (front-end-of-line)...
Authors: Aaldert Zijlstra, Tom Janssens, Kurt Wostyn, Michel Versluis, Paul W. Mertens, Detlef Lohse
Abstract:Since the introduction of megasonic cleaning in semiconductor industry a debate has been going on about which physical mechanism is...
Authors: Andrea Otto, Till Nowak, Robert Mettin, Frank Holsteyns, Alexander Lippert
Authors: Guillaume Briend, Pascal Besson, Thierry Salvetat, Sébastien Petitdidier
Abstract:More and more, 300mm manufacturing promotes a single wafer tool approach in FEOL cleaning. Previously, we reported an advanced surface...
Authors: Cole Franklin
Abstract:It has been shown that megasonics can accelerate strip processes such as doped and plasma treated photoresist [1]. However, applied...
Authors: Tom Janssens, G. Doumen, S. Halder, Kurt Wostyn, Paul W. Mertens, Joachim Straka
Abstract:A non uniform sound field distribution can be a problem in a megasonic cleaning system, since a higher sound intensity can cause damage,...
Showing 1 to 10 of 91 Paper Titles