Today, the use of Pods or FOUPs (Front Opening Universal Pod) in IC manufacturing leads to specific molecular contamination issues related to the enclosed environment made with porous polymers (mainly PEEK, PC and PP) that constitute these containers. Indeed, such materials are known to outgass airborne molecular contaminants (AMC), especially polymers additives [1,2]. They are also able to absorb volatile compounds present in their atmosphere coming from the connection to an equipment or from the release of wafers just processed [3,4]. As a result, a reversible outgassing of species previously trapped in plastic is possible. This is especially critical in presence of wafers sensitive to the released contaminants leading then to potential detrimental impacts. This cross-contamination scheme was clearly evidenced for volatile acids in presence of Cu layers leading to corrosion issues .