Paper Title:
Influence of Wet Cleaning on Tungsten Deposited with Different Techniques
  Abstract

Tungsten is a metal widely used for interconnections. As a consequence of more stringent requirements in terms of aspect ratio deriving from device shrinking, the filling of W plugs is becoming more and more critical and new deposition techniques need to be employed to properly fill contacts and trenches. For example ALD nucleation layers need to be coupled to CVD deposition. Since physical-chemical properties of W are heavily influenced by deposition techniques, the effect of wet cleanings on different kind of W needs to be fully understood in order to avoid any kind of W corrosion or recession during wet cleaning with W exposed. In this paper the effect of several chemicals commonly used in BEOL wet cleanings for polymer removal, has been investigated on W films deriving from both CVD and ALD deposition techniques.

  Info
Periodical
Solid State Phenomena (Volumes 145-146)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
197-200
DOI
10.4028/www.scientific.net/SSP.145-146.197
Citation
A. Votta, F. Pipia, S. Borsari, E. Ravizza, A. C. Elbaz, M. Alessandri, E. Bellandi, C. Bresolin, "Influence of Wet Cleaning on Tungsten Deposited with Different Techniques", Solid State Phenomena, Vols. 145-146, pp. 197-200, 2009
Online since
January 2009
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Carey M. Tanner, Jun Lu, Hans Olof Blom, Jane P. Chang
Abstract:The material properties of HfO2 thin films were studied to evaluate their potential as a high-κ gate dielectric in 4H-SiC power...
1075
Authors: Won Jun Lee, Min Ho Chun, Kwang Su Cheong, Kwang Chol Park, Chong Ook Park, Guo Zhong Cao, Sa Kyun Rha
Abstract:SiO2 films were prepared by atomic layer deposition (ALD) technique, and their physical and electrical properties were characterized for...
247
Authors: Francesco Pipia, Annamaria Votta, Enrica Ravizza, Simona Spadoni, S. Grasso, S. Borsari, C. Lazzari, Mauro Alessandri
Chapter 7: Back-End-of-Line Cleaning
Abstract:Tungsten importance in semiconductor manufacturing is renewed more and more due to its usage not only as metallization for plugs, but also in...
227
Authors: Rosniza Hussin, Kwang Leong Choy, Xiang Hui Hou
Abstract:ALD is a precision growth technique that can deposit either amorphous or polycrystalline thin films on a variety of substrates. The...
147