Paper Title:
Porous Low-k Wet Etch in HF-Based Solutions: Focus on Cleaning Process Window, "Pore-Sealing" and "k Recovery"
  Abstract

In this study, the compatibility of "HF-Based" cleaning with porous low-k integration, and “pore-sealing” approach was investigated, and specific attention was paid to ultra low-k porosity evolution. We also tried to demonstrate if "k-recovery" could be achieved by thinning the modified surface layer in the pattern trench walls (plasma damaged layer), for 65nm and 45 nm design rules.

  Info
Periodical
Solid State Phenomena (Volumes 145-146)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
295-302
DOI
10.4028/www.scientific.net/SSP.145-146.295
Citation
L. Broussous, W. Puyrenier, D. Rebiscoul, V. Rouessac, A. Ayral, "Porous Low-k Wet Etch in HF-Based Solutions: Focus on Cleaning Process Window, "Pore-Sealing" and "k Recovery" ", Solid State Phenomena, Vols. 145-146, pp. 295-302, 2009
Online since
January 2009
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Price
$32.00
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