Paper Title:
Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage
  Abstract

In semiconductor processing, test wafers are used as particle monitors, film thickness monitors for deposition and oxide growth measurements, dry/wet etch rate monitors, CMP monitors, as well as characterizing new and existing equipment and processes. Depending on fab size and capacity, monthly test wafer usage can be tens of thousands or more. Due to the ever increasing demand for silicon between the IC and solar markets and the high cost of 300mm wafers, chip manufacturers are increasing their efforts to reduce overall spending on silicon - currently by far the largest non equipment related cost [1]. One approach taken by many chip makers is the concept of extending the usable life of test wafers by re-using them as many times as possible through a reclaim process.

  Info
Periodical
Solid State Phenomena (Volumes 145-146)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
339-342
DOI
10.4028/www.scientific.net/SSP.145-146.339
Citation
M. Robson, K. A. Fletcher, P. Jiang, M. B. Korzenski, A. Upham, T. Haigh Jr., T. J.C. Hsieh, "Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage ", Solid State Phenomena, Vols. 145-146, pp. 339-342, 2009
Online since
January 2009
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Price
$32.00
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