Paper Title:
Borderless via Clean Study for Minimizing Al-Cu Loss in 58nm Flash Devices
  Abstract

The borderless (BDL) vias landing on the metal lines were demanded in high-density flash memory devices due to the reduced die size, compared with non-borderless (NBDL) vias. IMD material recess in un-landed via dry etching and the Al-Cu metal line undercut caused by post-etch cleaning may lead to via resistance Rv high and EM reliability issue. In this work, the Al-Cu loss mechanism in BDL-via cleaning by using amine- and fluoride-based chemicals were studied in 58nm flash devices. We found that the Al-Cu undercut can be minimized in HDA containing solvent by controlling the formation of Al2O3/Al/HDA gel-like material to the less amounts; the shorter HDA processing time with sufficient IPA rinse generated the thinner gel-like layer leading to the less Al-Cu undercut in DIW rinse step. For TMAH/H2O2-containing semi-aqueous solution, the metal contained etched-residues can be removed by reaction of OH- with Al to form dissolved Al(OH)4-; addition of H2O2 will form a oxidized passivation layer on the metal surface to prevent from metal corrosion. On the other hand, the Al/Al2O3 contained polymer was removed by fluoride-based solvent or DSP+ through the reaction with [F-] to form the DIW-dissolved AlFx by-products; while the dilute H2SO4 and H2O2 in DSP+ will oxidize Al to form Al2O3 that will be further etched by HF, the severe Al-Cu undercut was found in DSP+.

  Info
Periodical
Solid State Phenomena (Volumes 145-146)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
357-360
DOI
10.4028/www.scientific.net/SSP.145-146.357
Citation
C. K. Chen, P. C. Yu, M. H. Lee, C. N. Wu, H. Matsuo, "Borderless via Clean Study for Minimizing Al-Cu Loss in 58nm Flash Devices", Solid State Phenomena, Vols. 145-146, pp. 357-360, 2009
Online since
January 2009
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$32.00
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