Paper Title:
Damage-Free Post-CMP Cleaning Solution for Low-k Fluorocarbon on Advanced Interconnects
  Abstract

As technology node progressing, ultra low-k film has been implemented to reduce RC delay in LSI circuit. A fluorocarbon (CFx) film is proposed as foreground ultra low-k film because of non-porous structure [1]. Although CFx film is expected to be stable for its structure advantage, damage-less process is anticipated to avoid dielectric constants change in subsequence process steps [2]. CMP and post CMP process are concerned to bring damage on devices, so the effect of post CMP cleaning solutions on CFx structure and electric property is evaluated.

  Info
Periodical
Solid State Phenomena (Volumes 145-146)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
381-384
DOI
10.4028/www.scientific.net/SSP.145-146.381
Citation
X. Gu, T. Nemoto, A. Teramoto, R. Hasebe, T. Ito, T. Ohmi, "Damage-Free Post-CMP Cleaning Solution for Low-k Fluorocarbon on Advanced Interconnects ", Solid State Phenomena, Vols. 145-146, pp. 381-384, 2009
Online since
January 2009
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: B.G. Sharma, Chris Prindle
Abstract:Interconnect RC delay is the limiting factor for device performance in submicron semiconductor technology. Copper and low-k dielectric...
357
Authors: A.W. Haryadi, Chang Kuk You, Shin Yoon Kim, Eui Kyun Park, Kyo Han Kim, Suk Young Kim
Abstract:Grit blasting using bioactive HA and biodegradable CMP followed by acid etching has been done. HNO3 and H3PO4 were used for the etching...
391
Authors: Yong Zheng Fang, Jia Yue Xu, Zhan Yong Wang, Li Li Hu
Abstract:Two kinds of Er-doped lithium phosphate glass have been chemically strengthened by ion exchange in a mixed binary melt of KNO3 and NaNO3 at...
1106
Authors: Hui Zhen Jin, Qiang Li, Xian Yu Jin, Ye Tian, Nan Guo Jin
Abstract:Boric acid (H3BO3) is often used for cooling the heat in nuclear power plant. Though the drastic measures have been...
252
Authors: Jin Ye Niu, Zhi Wei Chen, Liu Feng, Zheng Min Li, Min Tan
Abstract:Fused silica micro-powders with D50 of 1.8μm were firstly prepared by ball milling. Effects of milling time on particle size...
129