Cleaning Technique Using High-Speed Steam-Water Mixed Spray |
| Journal |
Solid State Phenomena (Volumes 145 - 146) |
| Volume |
Ultra Clean Processing of Semiconductor Surfaces IX |
| Edited by |
Paul Mertens, Marc Meuris and Marc Heyns |
| Pages |
43-46 |
| DOI |
10.4028/www.scientific.net/SSP.145-146.43 |
| Online since |
January, 2009 |
| Authors |
Masao Watanabe,
Toshiyuki Sanada,
Atsushi Hayashida,
Yoichi Isago
|
| Keywords |
Cleaning, Droplet, Particle, Spray, Steam-Water Mixture, Super-Purified Water |
| Abstract |
A novel cleaning technique using steam-water mixed spray is proposed. Relatively low-pressure super-purified steam (0.1 MPa - 0.2 MPa) is mixed with super-purified water in a nozzle, and then sprayed on a silicon wafer surface, which is located at approximately 10 mm from the nozzle. The most striking result of this proposed technique is that we are able to clean a wafer surface, i.e., to eliminate fine particles, without using any chemicals. |
| Full Paper |
Get the full paper by clicking here
|
| Preview |
Free first page example |
