Paper Title:
Cleaning Technique Using High-Speed Steam-Water Mixed Spray
  Abstract

A novel cleaning technique using steam-water mixed spray is proposed. Relatively low-pressure super-purified steam (0.1 MPa - 0.2 MPa) is mixed with super-purified water in a nozzle, and then sprayed on a silicon wafer surface, which is located at approximately 10 mm from the nozzle. The most striking result of this proposed technique is that we are able to clean a wafer surface, i.e., to eliminate fine particles, without using any chemicals.

  Info
Periodical
Solid State Phenomena (Volumes 145-146)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
43-46
DOI
10.4028/www.scientific.net/SSP.145-146.43
Citation
M. Watanabe, T. Sanada, A. Hayashida, Y. Isago, "Cleaning Technique Using High-Speed Steam-Water Mixed Spray", Solid State Phenomena, Vols. 145-146, pp. 43-46, 2009
Online since
January 2009
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Price
$32.00
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