Cleaning Technique Using High-Speed Steam-Water Mixed Spray |
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| Journal | Solid State Phenomena (Volumes 145 - 146) |
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| Volume | Ultra Clean Processing of Semiconductor Surfaces IX |
| Edited by | Paul Mertens, Marc Meuris and Marc Heyns |
| Pages | 43-46 |
| DOI | 10.4028/www.scientific.net/SSP.145-146.43 |
| Citation | Masao Watanabe et al., 2009, Solid State Phenomena, 145-146, 43 |
| Online since | January, 2009 |
| Authors | Masao Watanabe, Toshiyuki Sanada, Atsushi Hayashida, Yoichi Isago |
| Keywords | Cleaning, Droplet, Particle, Spray, Steam-Water Mixture, Super-Purified Water |
| Abstract | A novel cleaning technique using steam-water mixed spray is proposed. Relatively low-pressure super-purified steam (0.1 MPa - 0.2 MPa) is mixed with super-purified water in a nozzle, and then sprayed on a silicon wafer surface, which is located at approximately 10 mm from the nozzle. The most striking result of this proposed technique is that we are able to clean a wafer surface, i.e., to eliminate fine particles, without using any chemicals. |
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