Paper Title:
Particle Retention Mechanism of Filter in High Temperature Chemical
  Abstract

Recently, the control of particles measured in the tens of nanometers has become indispensable for manufacturing semiconductor devices. In sulfuric acid - hydrogen peroxide mixture (SPM) processes, it is increasingly important to reduce particles on the wafer. A batch type re-circulation bath has been generally used with a fluoroplastic filter built into the equipment. The pore size of the filter used has gradually become smaller. The particle levels on the wafer have decreased after the filter was changed from a 100nm rating to a 30nm rating.

  Info
Periodical
Solid State Phenomena (Volumes 145-146)
Edited by
Paul Mertens, Marc Meuris and Marc Heyns
Pages
69-72
DOI
10.4028/www.scientific.net/SSP.145-146.69
Citation
T. Nagafuchi, K. Chiba, I. Funahashi, M. Inukai, H. Yamada, K. Umezawa, H. Tomita, "Particle Retention Mechanism of Filter in High Temperature Chemical", Solid State Phenomena, Vols. 145-146, pp. 69-72, 2009
Online since
January 2009
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