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Authors: Takuya Nagafuchi, Koji Chiba, Isamu Funahashi, Minako Inukai, Hiroaki Yamada, Kaori Umezawa, Hiroshi Tomita
Abstract:Recently, the control of particles measured in the tens of nanometers has become indispensable for manufacturing semiconductor devices. In...
69
Authors: Ai Wen Wu, Gregg Cornner, Vinay Prabhaker
Abstract:To achieve uniform copper plating on the surface of the wafer consistently in a production lot, a particle-free plating solution must be...
73
Authors: Lukasz Hupka, Jakub Nalaskowski, Nishant Sinha, Joseph N. Greeley, Zak Clark, Hao Du, William P. Johnson, Jan D. Miller
Abstract:Interfacial interaction forces between particulate contaminants and semiconductor wafer surfaces play a key role in the understanding of...
77
Authors: Antoine Pacco, Masayuki Wada, Twan Bearda, Paul W. Mertens
Abstract:Nanostructures with high aspect ratios, HAR, (ratio of height to lateral feature size) are of interest for many applications. One of the...
87
Authors: N. Kurumoto, Atsuro Eitoku, Katsuhiko Miya
Abstract:As the critical dimension of LSI continues to decrease, the surface tension of water and its effect on the formation of watermarks is...
91
Authors: Andreas Nutsch, Burkhard Beckhoff, Roswitha Altmann, J.A. Van den Berg, D. Giubertoni, Philipp Hönicke, M. Bersani, Andreas Leibold, F. Meirer, Matthias Müller, G. Pepponi, Michael Otto, P. Petrik, M. Reading, Lothar Pfitzner, Heiner Ryssel
Abstract:The continuous dimensional reduction drives the development of metrology, analysis and characterization for nano and micro electronics. An...
97
Authors: Burkhard Beckhoff, Andreas Nutsch, Roswitha Altmann, G. Borionetti, C. Pello, Maria Luisa Polignano, Davide Codegoni, Salvo Grasso, Elena Cazzini, M. Bersani, P. Lazzeri, S. Gennaro, Michael Kolbe, Matthias Müller, P. Kregsamer, Florian Posch
Abstract:As the detection of inorganic contaminants is of steadily increasing importance for the improvement of yields in microelectronic...
101
Authors: Hikari Takahara, Ken Tsugane
Abstract:In the semiconductor industry, the edge exclusion of processed wafers is decreasing to accommodate more integrated circuits. With this...
105
Authors: Adrien Danel, S. Sage, M.C. Roure, D. Peters, Jeff Hawthorne, R. Spicer
Abstract:The monitoring and optimization of wet clean and surface preparation processes is a major challenge in the microelectronics industry [1, 2]....
109
Authors: Ayako Shimazaki, Hiroki Sakurai, Masao Iwase, Reiko Yoshimura, Tsukasa Tada
Abstract:Contamination control has become a high-centered issue for the fabrication yield, performance and reliability of leading-edge ULSI devices. ...
115
Showing 21 to 30 of 91 Paper Titles