Paper Title
Page
Authors: Lucile Broussous, W. Puyrenier, D. Rebiscoul, V. Rouessac, A. Ayral
Abstract:In this study, the compatibility of "HF-Based" cleaning with porous low-k integration, and “pore-sealing” approach was investigated, and...
295
Authors: In Gu Song, Christopher Timmons, Galit Levitin, Dennis W. Hess
Abstract:Approximately 20% of the processing steps in integrated circuit (IC) fabrication involve surface cleaning and removal of photoresist and...
303
Authors: Mathias Guder, Maren Pellowska, Maximilian Pohland, Michael Dalmer, Bernd O. Kolbesen
Abstract:This work deals with the application of ozonated water for the BEOL stripping of DUV-resists. For this purpose analytical techniques for the...
311
Authors: Tomoko Suzuki, Atsushi Otake, Tomoko Aoki
Abstract:At 32nm and below the integration of extreme low-k dielectrics (ELK) with a permittivity of 2.2 or lower will require considerable process...
315
Authors: Nicole Ahner, Matthias Schaller, Christin Bartsch, Eugene Baryschpolec, Stefan E. Schulz
Abstract:The removal of plasma etch residues by wet cleaning is an alternative or additional process to plasma processes, which are known to degrade...
319
Authors: Quoc Toan Le, Els Kesters, L. Prager, Martine Claes, Marcel Lux, Guy Vereecke
Abstract:In Back-End-of-Line processing, the remaining photoresist layer after plasma etch is traditionally removed using a plasma process. Plasma...
323
Authors: Hidekazu Okamoto, Hideo Namatsu
Abstract:The development of new functional cleaning agents is strongly required for leading-edge LSI fabrication, such as resist removal process...
327
Authors: Jung Shik Heo, Jun Hwan Oh, Hong Jae Shin, Nae In Lee
Abstract:Copper has been widely used as the interconnect material for integrated circuits because of the good electrical conductivity and electron...
331
Authors: D.W. Tee, S.M. Francis, N.V. Richardson, Chris Reid, Larry McGhee
Abstract:Iminodiacetic acid (IMDA), NH(CH2CO2H)2, whose molecular structure is shown in figure 1, is a small molecule but has a very large scope for...
335
Authors: Mark Robson, Kristin A. Fletcher, Ping Jiang, Michael B. Korzenski, A. Upham, T. Haigh Jr., Thomas J.C. Hsieh
Abstract:In semiconductor processing, test wafers are used as particle monitors, film thickness monitors for deposition and oxide growth measurements,...
339
Showing 71 to 80 of 91 Paper Titles