Paper Title:
Plasma-Engineered Polymer Thin Films with Embedded Nanosilver for Prevention of Microbial Adhesion
  Abstract

The present project is focused on the plasma-deposition of thin films (~150 nm) containing silver nanoparticles embedded in a polymeric matrix, to prevent microbial adhesion to stainless steel. The process originality relies on a dual strategy associating silver target sputtering and plasma polymerization in argon-hexamethyldisiloxane (HMDSO) plasma, using an asymmetrical RF discharge (13.56 MHz). The physico-chemical properties of the obtained films were investigated by transmission FTIR and XPS. To determine the anti-adhesive efficiency, detachment experiments were performed in a shear stress flow chamber with silver-containing and silver-free deposits. The maximal detachment efficiency was achieved with the polymeric matrix alone. Silver antimicrobial effect is assumed to be related to Ag+ ion progressive release from the embedded particles into the surrounding medium. This release was confirmed by ICP-MS measurements. Furthermore, film biocide activity was observed for silver-containing film.

  Info
Periodical
Solid State Phenomena (Volume 151)
Edited by
Erich Kny
Pages
95-100
DOI
10.4028/www.scientific.net/SSP.151.95
Citation
C. Saulou, B. Despax, P. Raynaud, S. Zanna, P. Marcus, M. Mercier-Bonin, "Plasma-Engineered Polymer Thin Films with Embedded Nanosilver for Prevention of Microbial Adhesion", Solid State Phenomena, Vol. 151, pp. 95-100, 2009
Online since
April 2009
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