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Plasma-Engineered Polymer Thin Films with Embedded Nanosilver for Prevention of Microbial Adhesion

Journal Solid State Phenomena (Volume 151)
Volume Nanocomposite Materials
Edited by Erich Kny
Pages 95-100
DOI 10.4028/www.scientific.net/SSP.151.95
Citation Claire Saulou et al., 2009, Solid State Phenomena, 151, 95
Online since April, 2009
Authors Claire Saulou, Bernard Despax, Patrice Raynaud, Sandrine Zanna, Philippe Marcus, Muriel Mercier-Bonin
Keywords Asymmetrical RF Discharge, Microbial Adhesion, Plasma-Mediated Thin Films, Polymeric Matrix, Silver Nanoparticle, Stainless Steel (SS)
Abstract

The present project is focused on the plasma-deposition of thin films (~150 nm) containing silver nanoparticles embedded in a polymeric matrix, to prevent microbial adhesion to stainless steel. The process originality relies on a dual strategy associating silver target sputtering and plasma polymerization in argon-hexamethyldisiloxane (HMDSO) plasma, using an asymmetrical RF discharge (13.56 MHz). The physico-chemical properties of the obtained films were investigated by transmission FTIR and XPS. To determine the anti-adhesive efficiency, detachment experiments were performed in a shear stress flow chamber with silver-containing and silver-free deposits. The maximal detachment efficiency was achieved with the polymeric matrix alone. Silver antimicrobial effect is assumed to be related to Ag+ ion progressive release from the embedded particles into the surrounding medium. This release was confirmed by ICP-MS measurements. Furthermore, film biocide activity was observed for silver-containing film.

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