Paper Title:
Grain Boundaries in Multicrystalline Si
  Abstract

We report the electrical, structural and mechanical properties of grain boundaries (GBs) in multicrystalline Si (mc-Si) based on electron-beam-induced current (EBIC), transmission electron microscope (TEM), and scanning infrared polariscope (SIRP) characterizations. The recombination activities of GBs are clearly classified with respect to GB character and Fe contamination level. The decoration of Fe impurity at boundary has been approved by annular dark field (ADF) imaging in TEM. Finally, the distribution of residual strain around GBs, and the correlations between strain and electrical properties are discussed.

  Info
Periodical
Solid State Phenomena (Volumes 156-158)
Edited by
M. Kittler and H. Richter
Pages
19-26
DOI
10.4028/www.scientific.net/SSP.156-158.19
Citation
J. Chen, B. Chen, W. Lee, M. Fukuzawa, M. Yamada, T. Sekiguchi, "Grain Boundaries in Multicrystalline Si", Solid State Phenomena, Vols. 156-158, pp. 19-26, 2010
Online since
October 2009
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Price
$32.00
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