Paper Title:
Solder Joint Reliability in Automotive Applications: New Assessment Criteria through the Use of EBSD
  Abstract

The transition to lead-free materials within the electronics industry has raised the question of solder joint reliability for automotive applications. Traditional analysis methods like shear testing and light microscopic cross section analysis do not offer explanations for different damage appearances of solder joints that seem to have same material properties, same production and aging history. A better understanding of microstructural properties and changes will help to solve those questions. Therefore, EBSD is used to analyze the grain structure of solder joints in the as-soldered state and after different aging conditions. In this paper a test program that is just being carried out at the Volkswagen Lab is summarized and first results of texture analysis are presented.

  Info
Periodical
Solid State Phenomena (Volume 160)
Edited by
H. Klein and R.A. Schwarzer
Pages
307-312
DOI
10.4028/www.scientific.net/SSP.160.307
Citation
A. Steller, U. Pape, L. Blair, "Solder Joint Reliability in Automotive Applications: New Assessment Criteria through the Use of EBSD ", Solid State Phenomena, Vol. 160, pp. 307-312, 2010
Online since
February 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa, Masao Kojima
Abstract:Impact properties of solder ball joints with Sn-9mass%Zn and Sn-3mass%Ag- 0.5mass%Cu lead-free solders were investigated under aging at 423...
429
Authors: Yu Feng Sun, De Jian Zhou, Qiang Zhao, Shao Hua Zhu
Abstract:This paper introduces the content included in two-dimensional quality information of the SMT solder joint and illustrates the basic principle...
704
Authors: Xian Xie, Gao Feng Quan, Xiue Gu, Xing Ming Liu, Jia Le Sun
Chapter 2: Surface Engineering/Coatings
Abstract:The brazing process of magnesium alloy AZ31 was studied, and the mechanical properties of the weld were examined, and the main factors were...
792
Authors: Chihiro Iwamoto, Shinobu Satonaka, Yoshihito Kawamura
Chapter 11: Magnesium Alloys
Abstract:Mg96Zn2Y2 is widely studied due to its high tensile yield strength and elongation. These excellent...
1187
Authors: M.A.A. Mohd Salleh, A.R. Nik Nurhidayatul Suhada, Flora Somidin, Rafezi Ahmad Khairel, C.S. Lee, Kamarudin Hussin
Chapter 2: Development of Novel Materials and their Characterization
Abstract:Electromigration effects on the solder joint formation of 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu lead-free solder with Cu electroplated Ni layer...
195