Paper Title:
Reactive Diffusion between Ti and Cu-9.3Sn-0.3Ti Alloy at Solid-State Temperatures
  Abstract

The reactive diffusion between Ti and a bronze was experimentally examined using sandwich diffusion couples consisting of Ti and a Cu-9.3Sn-0.3Ti alloy. The diffusion couples were isothermally annealed at temperatures of T = 923-1023 K. During annealing, CuTi, (Cu, Sn)4Ti3 and (Sn, Cu)5Ti6 compounds are formed as layers at the interface in the diffusion couple. The overall growth of the compound layers is controlled by volume diffusion at T = 1023 K but by boundary and volume diffusion at T = 923-973 K. Hence, the interface reaction is not the bottleneck for the growth of the compound layers under the present experimental conditions.

  Info
Periodical
Solid State Phenomena (Volumes 172-174)
Edited by
Yves Bréchet, Emmanuel Clouet, Alexis Deschamps, Alphonse Finel and Frédéric Soisson
Pages
470-474
DOI
10.4028/www.scientific.net/SSP.172-174.470
Citation
M. Kajihara, S. Nakamura, "Reactive Diffusion between Ti and Cu-9.3Sn-0.3Ti Alloy at Solid-State Temperatures", Solid State Phenomena, Vols. 172-174, pp. 470-474, 2011
Online since
June 2011
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$32.00
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