Slicing the wafers with diamond wire saw is recently paid much attention. This study proposes a novel method for developing a kind of diamond wire saws with ultraviolet curing resin and spraying technique. The process of wire saw manufacturing and the selection of optimal parameters are introduced. The experiments of the slicing marble are carried out using different diamond wire saws. The effects of wire saw running speed, work-piece in-feed speed, work-piece rotation frequency on the material removal rate, and surface roughness were investigated. Result shows that new method for development of diamond wire saw is feasible.